A Massachusetts startup advances scalable light-control tech for AR, AI and imaging markets
Updated
February 27, 2026 3:59 PM

Myrias Optics' Nanoimprinted All-inorganic Metaoptic. PHOTO: MYRIAS OPTICS
Myrias Optics, a Massachusetts-based optical technology startup, has raised US$2.1 million in a Seed 1 financing round to accelerate the commercialization of its advanced light-control technology. The round was led by MassVentures, with participation from existing investors Hoss Investment Inc., Maroon Venture Partners and Tenon Venture Partners, as well as new investors Mill Town Capital, TiE Boston Angels and Doug Crane. This new round follows a US$3.3 million seed financing completed in December 2023, led by Asia Optical, and a US$1.5 million Direct-to-Phase II award from the National Science Foundation. In total, Myrias has secured US$6.9 million to date, positioning it to move from development to scaled production.
The company builds ultra-thin, nano-patterned surfaces that precisely control how light moves through a device. These structures replace or enhance traditional lenses and optical parts inside products such as augmented reality headsets, AI data center hardware, consumer electronics, industrial systems and medical imaging devices. The goal is straightforward: to deliver high optical performance while making the parts easier and more cost-effective to manufacture in large quantities.
Across industries such as augmented reality and AI infrastructure, manufacturers face a common challenge. They need highly precise light-guiding components that can withstand heat and long-term use. At the same time, those components must be produced consistently and at scale. Traditional semiconductor-style fabrication can be costly, while polymer-based optical manufacturing can face limits in durability and thermal stability.
Myrias addresses this gap by using inorganic materials and a nanoimprint manufacturing process to create stable, repeatable optical layers on wafers. This approach is designed to combine performance with manufacturability. In augmented reality systems, for example, the company’s technology enables higher viewing angles while remaining suitable for volume production. In AI data centers, the same material and process advantages support improved light transfer and stronger performance under demanding thermal conditions. These benefits also extend to advanced imaging systems in consumer, industrial and medical markets.
The new Seed 1 funding is intended to expand manufacturing capacity and scale pilot production lines. The company will also continue executing active customer programs. Myrias is already working with strategic partners and Tier 1 supply chain participants to integrate its waveguide and light-shaping solutions into commercial AR platforms, AI photonics systems and advanced imaging products. The capital, therefore, supports a clear next step: moving from validated prototypes to a steady commercial supply.
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The quiet infrastructure shift powering the next generation of data centers
Updated
February 12, 2026 1:21 PM

Peripheral Component Interconnect Express (PCIe) port on a motherboard, coloured yellow. PHOTO: UNSPLASH
Modern data centers operate on a simple yet fundamental principle: computers require the ability to share data extremely quickly. As AI and cloud systems grow, servers are no longer confined to a single rack. They are spread across many racks, sometimes across entire rooms. When that happens, moving data quickly and cleanly becomes harder.
Montage Technology, a Shanghai-based semiconductor company, builds the chips and connection systems that help servers exchange data without delays. This week, the company announced a new Active Electrical Cable (AEC) solution based on PCIe 6.x and CXL 3.x — two important standards used to connect CPUs, GPUs, network cards and storage inside modern data centers.
In simple terms, Montage’s new AEC product helps different parts of a data center “talk” to each other faster and more reliably, even when those parts are physically far apart.
As data centers grow to support AI and cloud workloads, their architecture is changing. Instead of everything sitting inside one rack, systems now stretch across multiple racks and even multiple rows. This creates a new problem: the longer the distance between machines, the harder it is to keep data signals clean and fast.
This is where Active Electrical Cables come in. Unlike regular copper cables, AECs include small electronic components inside the cable itself. These components strengthen and clean up the data signal as it travels, so information can move farther without getting distorted or delayed.
Montage’s solution uses its own retimer chip based on PCIe 6.x and CXL 3.x. A “retimer” refreshes the data signal so it arrives accurately at the other end. This allows servers, GPUs, storage devices and network cards to stay tightly connected even across longer distances inside large data centers.
The company also uses high-density cable designs and built-in monitoring tools so operators can track performance and fix issues faster. That makes large data centers easier to deploy and maintain.
According to Montage, the solution has already passed interoperability tests with CPUs, xPUs, PCIe switches and network cards. It has also been jointly developed with cable manufacturers in China and validated at the system level.
What makes this development important is not just speed. It is about scale. AI models, cloud services and real-time applications demand massive amounts of data to move continuously between machines. If that movement slows down, everything else slows with it.
By improving how machines connect across racks, Montage’s AEC solution supports the kind of infrastructure that next-generation AI and cloud systems depend on.
Looking ahead, the company plans to expand its high-speed interconnect products further, including work on PCIe 7.0 and Ethernet retimer technologies.
Quietly, in the background of every AI system and cloud service, there is a network of cables and chips doing the hard work of moving data. Montage’s latest launch focuses on making that hidden layer faster, cleaner and ready for the scale that modern computing now demands.