The quiet infrastructure shift powering the next generation of data centers
Updated
January 30, 2026 11:42 AM
Peripheral Component Interconnect Express (PCIe) port on a motherboard, coloured yellow. PHOTO: UNSPLASH
Modern data centers operate on a simple yet fundamental principle: computers require the ability to share data extremely quickly. As AI and cloud systems grow, servers are no longer confined to a single rack. They are spread across many racks, sometimes across entire rooms. When that happens, moving data quickly and cleanly becomes harder.
Montage Technology, a Shanghai-based semiconductor company, builds the chips and connection systems that help servers exchange data without delays. This week, the company announced a new Active Electrical Cable (AEC) solution based on PCIe 6.x and CXL 3.x — two important standards used to connect CPUs, GPUs, network cards and storage inside modern data centers.
In simple terms, Montage’s new AEC product helps different parts of a data center “talk” to each other faster and more reliably, even when those parts are physically far apart.
As data centers grow to support AI and cloud workloads, their architecture is changing. Instead of everything sitting inside one rack, systems now stretch across multiple racks and even multiple rows. This creates a new problem: the longer the distance between machines, the harder it is to keep data signals clean and fast.
This is where Active Electrical Cables come in. Unlike regular copper cables, AECs include small electronic components inside the cable itself. These components strengthen and clean up the data signal as it travels, so information can move farther without getting distorted or delayed.
Montage’s solution uses its own retimer chip based on PCIe 6.x and CXL 3.x. A “retimer” refreshes the data signal so it arrives accurately at the other end. This allows servers, GPUs, storage devices and network cards to stay tightly connected even across longer distances inside large data centers.
The company also uses high-density cable designs and built-in monitoring tools so operators can track performance and fix issues faster. That makes large data centers easier to deploy and maintain.
According to Montage, the solution has already passed interoperability tests with CPUs, xPUs, PCIe switches and network cards. It has also been jointly developed with cable manufacturers in China and validated at the system level.
What makes this development important is not just speed. It is about scale. AI models, cloud services and real-time applications demand massive amounts of data to move continuously between machines. If that movement slows down, everything else slows with it.
By improving how machines connect across racks, Montage’s AEC solution supports the kind of infrastructure that next-generation AI and cloud systems depend on.
Looking ahead, the company plans to expand its high-speed interconnect products further, including work on PCIe 7.0 and Ethernet retimer technologies.
Quietly, in the background of every AI system and cloud service, there is a network of cables and chips doing the hard work of moving data. Montage’s latest launch focuses on making that hidden layer faster, cleaner and ready for the scale that modern computing now demands.
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Rethinking 3D modelling for a world that generates too much, too quickly.
Updated
January 8, 2026 6:32 PM
A hologram in the franchise Star Wars, in Walt Disney World Resort, Orlando. PHOTO: UNSPLASH
MicroCloud Hologram Inc. (NASDAQ: HOLO), a technology service provider recognized for its holography and imaging systems, is now expanding into a more advanced realm: a quantum-driven 3D intelligent model. The goal is to generate detailed 3D models and images with far less manual effort — a need that has only grown as industries flood the world with more visual data every year.
The concept is straightforward, even if the technology behind it isn’t. Traditional 3D modeling workflows are slow, fragmented and depend on large teams to clean datasets, train models, adjust parameters and fine-tune every output. HOLO is trying to close that gap by combining quantum computing with AI-powered 3D modeling, enabling the system to process massive datasets quickly and automatically produce high-precision 3D assets with much less human involvement.
To achieve this, the company developed a distributed architecture comprising of several specialized subsystems. One subsystem collects and cleans raw visual data from different sources. Another uses quantum deep learning to understand patterns in that data. A third converts the trained model into ready-to-use 3D assets based on user inputs. Additional modules manage visualization, secure data storage and system-wide protection — all supported by quantum-level encryption. Each subsystem runs in its own container and communicates through encrypted interfaces, allowing flexible upgrades and scaling without disrupting the entire system.
Why this matters: Industries ranging from gaming and film to manufacturing, simulation and digital twins are rapidly increasing their reliance on 3D content. The real bottleneck isn’t creativity — it’s time. Producing accurate, high-quality 3D assets still requires a huge amount of manual processing. HOLO’s approach attempts to lighten that workload by utilizing quantum tools to speed up data processing, model training, generation and scaling, while keeping user data secure.
According to the company, the system’s biggest advantages include its ability to handle massive datasets more efficiently, generate precise 3D models with fewer manual steps, and scale easily thanks to its modular, quantum-optimized design. Whether quantum computing will become a mainstream part of 3D production remains an open question. Still, the model shows how companies are beginning to rethink traditional 3D workflows as demand for high-quality digital content continues to surge.