Bitmo Lab is testing an ultra-thin, bendable tracker built to fit inside items traditional trackers can’t
Updated
February 12, 2026 4:43 PM
Bitmo Lab's MeetSticker tracker. PHOTO: BITMO LAB
Location trackers have become everyday accessories for keys, bags and luggage. But as personal items grow slimmer and more design-focused — from minimalist wallets to passport sleeves and specialised gear — tracking them has become less straightforward. Most trackers are built as small, rigid discs that assume the presence of space, loops or compartments. That assumption has created a growing mismatch between modern product design and the technology meant to secure it.
Hong Kong–based startup Bitmo Lab is attempting to address that gap with a device called MeetSticker. Instead of the solid plastic casing typical of most trackers, MeetSticker is engineered to be flexible and ultra-thin, measuring just 0.8 millimetres thick. The bendable design allows it to sit within narrow compartments or along curved surfaces without altering the shape of the object. Rather than attaching to an item externally, it is intended to integrate discreetly inside it.
That structural shift is the core of the product’s proposition. By removing the rigid shell that defines conventional tracking hardware, MeetSticker can be placed in items that previously had no practical way to accommodate a tracker. Bitmo Lab states that the device connects through a proprietary network and a companion application compatible with both iOS and Android, positioning it as a cross-platform solution rather than one tied to a single ecosystem.
The implications extend beyond form factor. Objects without obvious attachment points — such as compact travel accessories or specialised tools — could potentially be monitored without visible add-ons. In doing so, the device broadens the scope of tracking technology into categories where aesthetics, aerodynamics or compact design matter as much as functionality.
Before moving toward retail distribution, however, the company is focusing on validation. Bitmo Lab has launched a five-week global alpha testing programme beginning February 9. Sixty participants will receive a prototype unit and early access to the app. According to the company, the programme is designed to assess durability, usability and real-world performance before a wider commercial release. Participants who provide feedback will receive a retail unit upon launch.
Such testing is particularly relevant for flexible electronics. Unlike rigid devices, bendable hardware must withstand repeated flexing, daily handling and environmental exposure. Early user data can help refine manufacturing processes and software optimisation before scaling production.
As with other connected tracking devices, privacy considerations remain part of the equation. Bitmo Lab has stated that data collected during the alpha programme will be used strictly for testing purposes and deleted once the programme concludes.
Whether flexible trackers will redefine the category will depend on how they perform outside controlled testing environments. Still, the introduction of a near-invisible, bendable tracking device reflects a broader shift in consumer technology. As everyday products become thinner and more design-conscious, the tools built to protect them may need to adapt just as seamlessly.
Keep Reading
The hidden cost of scaling AI: infrastructure, energy, and the push for liquid cooling.
Updated
January 8, 2026 6:31 PM
The inside of a data centre, with rows of server racks. PHOTO: FREEPIK
As artificial intelligence models grow larger and more demanding, the quiet pressure point isn’t the algorithms themselves—it’s the AI infrastructure that has to run them. Training and deploying modern AI models now requires enormous amounts of computing power, which creates a different kind of challenge: heat, energy use and space inside data centers. This is the context in which Supermicro and NVIDIA’s collaboration on AI infrastructure begins to matter.
Supermicro designs and builds large-scale computing systems for data centers. It has now expanded its support for NVIDIA’s Blackwell generation of AI chips with new liquid-cooled server platforms built around the NVIDIA HGX B300. The announcement isn’t just about faster hardware. It reflects a broader effort to rethink how AI data center infrastructure is built as facilities strain under rising power and cooling demands.
At a basic level, the systems are designed to pack more AI chips into less space while using less energy to keep them running. Instead of relying mainly on air cooling—fans, chillers and large amounts of electricity, these liquid-cooled AI servers circulate liquid directly across critical components. That approach removes heat more efficiently, allowing servers to run denser AI workloads without overheating or wasting energy.
Why does that matter outside a data center? Because AI doesn’t scale in isolation. As models become more complex, the cost of running them rises quickly, not just in hardware budgets, but in electricity use, water consumption and physical footprint. Traditional air-cooling methods are increasingly becoming a bottleneck, limiting how far AI systems can grow before energy and infrastructure costs spiral.
This is where the Supermicro–NVIDIA partnership fits in. NVIDIA supplies the computing engines—the Blackwell-based GPUs designed to handle massive AI workloads. Supermicro focuses on how those chips are deployed in the real world: how many GPUs can fit in a rack, how they are cooled, how quickly systems can be assembled and how reliably they can operate at scale in modern data centers. Together, the goal is to make high-density AI computing more practical, not just more powerful.
The new liquid-cooled designs are aimed at hyperscale data centers and so-called AI factories—facilities built specifically to train and run large AI models continuously. By increasing GPU density per rack and removing most of the heat through liquid cooling, these systems aim to ease a growing tension in the AI boom: the need for more computers without an equally dramatic rise in energy waste.
Just as important is speed. Large organizations don’t want to spend months stitching together custom AI infrastructure. Supermicro’s approach packages compute, networking and cooling into pre-validated data center building blocks that can be deployed faster. In a world where AI capabilities are advancing rapidly, time to deployment can matter as much as raw performance.
Stepping back, this development says less about one product launch and more about a shift in priorities across the AI industry. The next phase of AI growth isn’t only about smarter models—it’s about whether the physical infrastructure powering AI can scale responsibly. Efficiency, power use and sustainability are becoming as critical as speed.