Endometriosis often takes years to diagnose. This ultrasound simulation innovation could help change that
Updated
March 17, 2026 1:01 AM
A group of women facing backwards. PHOTO: UNSPLASH
Endometriosis affects roughly one in ten women worldwide, yet diagnosing the condition often takes years. In many cases, patients experience symptoms for nearly a decade before receiving a confirmed diagnosis. One reason is that detecting endometriosis through ultrasound requires specialized training and clinicians do not always encounter enough real cases to build that expertise.
To address this gap, medical simulation company Surgical Science has introduced a new ultrasound training module designed specifically for identifying endometriosis. The system allows clinicians to practice scanning techniques in a virtual environment, helping them recognize signs of the disease without relying solely on real-patient cases.
A key feature of the simulator is training on the “sliding sign,” an ultrasound indicator used to detect deep endometriosis. Because the condition can appear differently from patient to patient, mastering this assessment in real clinical settings can be difficult. The simulator allows clinicians to repeat the process across multiple scenarios, improving their ability to identify the condition during routine examinations.
The module also incorporates the International Deep Endometriosis Analysis (IDEA) protocol, which provides a structured method for performing a complete pelvic ultrasound assessment. Additional training cases, region-based scenarios and certification options are included to support standardized learning.
Early training results suggest strong improvements in clinician confidence, including higher skill levels in transvaginal ultrasound and better recognition of deep endometriosis. By expanding access to structured ultrasound training, simulation tools like this could help reduce diagnostic delays and improve care for millions of women living with the condition.
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The hidden cost of scaling AI: infrastructure, energy, and the push for liquid cooling.
Updated
January 8, 2026 6:31 PM
The inside of a data centre, with rows of server racks. PHOTO: FREEPIK
As artificial intelligence models grow larger and more demanding, the quiet pressure point isn’t the algorithms themselves—it’s the AI infrastructure that has to run them. Training and deploying modern AI models now requires enormous amounts of computing power, which creates a different kind of challenge: heat, energy use and space inside data centers. This is the context in which Supermicro and NVIDIA’s collaboration on AI infrastructure begins to matter.
Supermicro designs and builds large-scale computing systems for data centers. It has now expanded its support for NVIDIA’s Blackwell generation of AI chips with new liquid-cooled server platforms built around the NVIDIA HGX B300. The announcement isn’t just about faster hardware. It reflects a broader effort to rethink how AI data center infrastructure is built as facilities strain under rising power and cooling demands.
At a basic level, the systems are designed to pack more AI chips into less space while using less energy to keep them running. Instead of relying mainly on air cooling—fans, chillers and large amounts of electricity, these liquid-cooled AI servers circulate liquid directly across critical components. That approach removes heat more efficiently, allowing servers to run denser AI workloads without overheating or wasting energy.
Why does that matter outside a data center? Because AI doesn’t scale in isolation. As models become more complex, the cost of running them rises quickly, not just in hardware budgets, but in electricity use, water consumption and physical footprint. Traditional air-cooling methods are increasingly becoming a bottleneck, limiting how far AI systems can grow before energy and infrastructure costs spiral.
This is where the Supermicro–NVIDIA partnership fits in. NVIDIA supplies the computing engines—the Blackwell-based GPUs designed to handle massive AI workloads. Supermicro focuses on how those chips are deployed in the real world: how many GPUs can fit in a rack, how they are cooled, how quickly systems can be assembled and how reliably they can operate at scale in modern data centers. Together, the goal is to make high-density AI computing more practical, not just more powerful.
The new liquid-cooled designs are aimed at hyperscale data centers and so-called AI factories—facilities built specifically to train and run large AI models continuously. By increasing GPU density per rack and removing most of the heat through liquid cooling, these systems aim to ease a growing tension in the AI boom: the need for more computers without an equally dramatic rise in energy waste.
Just as important is speed. Large organizations don’t want to spend months stitching together custom AI infrastructure. Supermicro’s approach packages compute, networking and cooling into pre-validated data center building blocks that can be deployed faster. In a world where AI capabilities are advancing rapidly, time to deployment can matter as much as raw performance.
Stepping back, this development says less about one product launch and more about a shift in priorities across the AI industry. The next phase of AI growth isn’t only about smarter models—it’s about whether the physical infrastructure powering AI can scale responsibly. Efficiency, power use and sustainability are becoming as critical as speed.